A device configured to maintain an electric circuit in a fixed position during an overmolding process comprises a wire retainer configured to hold the electric circuit taut and in a fixed position while being molded within a molded item. The retainer has a first end and an opposite second end, and includes a first bushing defining a mounting hole for the molded item extending along a width axis. The built-in bushing includes front and back surfaces configured to be aligned and substantially co-planar with the front and back surfaces of the molded item. The device also includes a first securing member configured to secure a portion of the electric circuit to the retainer within the molded item, to hold the electric circuit in a fixed position within the molded item during the overmolding process.