Invention Grant
US07963021B2 Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package
有权
嵌入基板的电感器，其制造方法，微器件封装以及用于微器件封装的帽的制造方法
- Patent Title: Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package
- Patent Title (中): 嵌入基板的电感器，其制造方法，微器件封装以及用于微器件封装的帽的制造方法
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Application No.: US12028420Application Date: 2008-02-08
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Publication No.: US07963021B2Publication Date: 2011-06-21
- Inventor: Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
- Applicant: Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR2005-0055796 20050627
- Main IPC: H01F7/06
- IPC: H01F7/06
Abstract:
An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
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