Invention Grant
- Patent Title: Mini-sized heat-dissipating module having an extra strength of assembled relationship
- Patent Title (中): 具有组合关系的额外强度的小型散热模块
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Application No.: US11727114Application Date: 2007-03-23
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Publication No.: US07963317B2Publication Date: 2011-06-21
- Inventor: Alex Horng
- Applicant: Alex Horng
- Applicant Address: TW Kaohsiung
- Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
- Current Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
- Current Assignee Address: TW Kaohsiung
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW96102483A 20070123
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A mini-sized heat-dissipating module includes a miniature heat-dissipating plate and a miniature fan unit. The miniature heat-dissipating plate has an assembling area, at least one airflow channel and at least one engaging portion. The assembling area and the airflow channel are provided on a top surface of the miniature heat-dissipating plate, wherein the assembling area is arranged at an end of the airflow channel. The miniature fan unit has an air inlet, an air outlet, a fan wheel and at least one engaging portion. The engaging portion of the miniature fan unit is engaged with that of the miniature heat-dissipating plate when assembled. An adhesive layer is further provided to combine the miniature fan unit with the miniature heat-dissipating plate.
Public/Granted literature
- US20080174956A1 Mini-sized heat-dissipating module having an extra strength of assembled relationship Public/Granted day:2008-07-24
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