Invention Grant
- Patent Title: Recess filling apparatus
- Patent Title (中): 凹陷灌装设备
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Application No.: US12341968Application Date: 2008-12-22
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Publication No.: US07963428B2Publication Date: 2011-06-21
- Inventor: Roy Searle , Jan Holland
- Applicant: Roy Searle , Jan Holland
- Applicant Address: GB Worcestershire
- Assignee: Nail Seal Limited
- Current Assignee: Nail Seal Limited
- Current Assignee Address: GB Worcestershire
- Agency: Tumey L.L.P.
- Main IPC: B25B23/04
- IPC: B25B23/04

Abstract:
A recess filling apparatus forms part of, or is for use with, a tool for driving a multiplicity of fixing elements into a work surface. The apparatus utilises a dispensing strip defining a multiplicity of chambers containing filler material, each chamber containing sufficient filler material for use with a single fixing element. The apparatus comprises means to support the dispensing strip, and means for locating a chamber that contains filler material in or adjacent to the path of a fixing element, and for advancing the dispensing strip prior to driving the next fixing element.
Public/Granted literature
- US20090188822A1 Recess Filling Apparatus Public/Granted day:2009-07-30
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