A holder manufacturing method for loading a substrate of a semiconductor manufacturing device, a batch type boat having the holder, a loading/unloading method of a semiconductor substrate using the same, and a semiconductor manufacturing device having the same are disclosed. For example, the manufacturing method of the holder of the boat for loading a semiconductor substrate includes the steps of molding a holder substrate of a pipe shape having inner and outer circumference of a predetermined size in such a manner that a lower portion of the semiconductor substrate is seated thereon; and forming a plurality of holder rings by cutting the holder rings from the holder substrate in such a manner that each holder ring is matched to a disposal interval of the semiconductor substrates in the boat. The manufacture of the holder and the batch type boat are simple by means of the holder ring supported on the supporting rods and the end-effector escapes the supporting rods, so that the pitch interval can be minimized, whereby it can load the compact semiconductor substrate to the boat, the amount of the substrate treatment can be improved and thus the productivity thereof can be improved.