Invention Grant
- Patent Title: Wafer processing apparatus with wafer alignment device
- Patent Title (中): 具有晶圆对准装置的晶片处理装置
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Application No.: US12062419Application Date: 2008-04-03
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Publication No.: US07963736B2Publication Date: 2011-06-21
- Inventor: Masahiro Takizawa , Masaei Suwada , Masayuki Akagawa
- Applicant: Masahiro Takizawa , Masaei Suwada , Masayuki Akagawa
- Applicant Address: JP Tokyo
- Assignee: ASM Japan K.K.
- Current Assignee: ASM Japan K.K.
- Current Assignee Address: JP Tokyo
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
A semiconductor-processing apparatus includes: a wafer handling chamber; a wafer processing chamber; a wafer handling device; a first photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer partially blocks light received by the first photosensor at a ready-to-load position and substantially entirely blocks light received by the first photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction; and a second photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer does not block light received by the second photosensor at the ready-to-load position and partially blocks light received by the second photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction.
Public/Granted literature
- US20090252580A1 WAFER PROCESSING APPARATUS WITH WAFER ALIGNMENT DEVICE Public/Granted day:2009-10-08
Information query
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