Invention Grant
US07963805B2 Low profile cable assembly 有权
薄型电缆组件

  • Patent Title: Low profile cable assembly
  • Patent Title (中): 薄型电缆组件
  • Application No.: US12570150
    Application Date: 2009-09-30
  • Publication No.: US07963805B2
    Publication Date: 2011-06-21
  • Inventor: David Ko
  • Applicant: David Ko
  • Applicant Address: TW New Taipei
  • Assignee: Hon Hai Precision Ind. Co., Ltd.
  • Current Assignee: Hon Hai Precision Ind. Co., Ltd.
  • Current Assignee Address: TW New Taipei
  • Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
  • Priority: CN200820302308 20080930
  • Main IPC: H01R9/03
  • IPC: H01R9/03
Low profile cable assembly
Abstract:
A cable assembly includes an insulation housing, a plurality of contacts, a plurality of wires and a spacer. The housing includes a mating portion, a pair of flat portions extending from two sides of the mating portion, and a receiving space formed between the two flat portions. Each of the contacts is received in the housing and has a rear surface. The wires are corresponding to the contacts and each wire is connected its corresponding contact. The spacer is attached to the housing and has a front surface attached to the rear surface of the contact. The spacer includes a plurality of slots received in the receiving space. And the wires are respectively received in the slots.
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