Invention Grant
- Patent Title: Low profile cable assembly
- Patent Title (中): 薄型电缆组件
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Application No.: US12570150Application Date: 2009-09-30
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Publication No.: US07963805B2Publication Date: 2011-06-21
- Inventor: David Ko
- Applicant: David Ko
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Priority: CN200820302308 20080930
- Main IPC: H01R9/03
- IPC: H01R9/03

Abstract:
A cable assembly includes an insulation housing, a plurality of contacts, a plurality of wires and a spacer. The housing includes a mating portion, a pair of flat portions extending from two sides of the mating portion, and a receiving space formed between the two flat portions. Each of the contacts is received in the housing and has a rear surface. The wires are corresponding to the contacts and each wire is connected its corresponding contact. The spacer is attached to the housing and has a front surface attached to the rear surface of the contact. The spacer includes a plurality of slots received in the receiving space. And the wires are respectively received in the slots.
Public/Granted literature
- US20100081335A1 LOW PROFILE CABLE ASSEMBLY Public/Granted day:2010-04-01
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