Invention Grant
- Patent Title: Water-based adhesive curing process and associated apparatus
- Patent Title (中): 水性胶粘剂固化工艺及相关设备
-
Application No.: US12285648Application Date: 2008-10-10
-
Publication No.: US07964056B2Publication Date: 2011-06-21
- Inventor: Anthony R. Bucco , William Zelman
- Applicant: Anthony R. Bucco , William Zelman
- Agent Thomas J. Germinario
- Main IPC: C09J5/02
- IPC: C09J5/02 ; B32B37/06
Abstract:
A process and implementing apparatus are disclosed by which the curing time of a water-based adhesive is shortened as applied to the bonding of two fibrous substrates, such as paperboard or corrugated fiberboard.
Public/Granted literature
- US20090114340A1 Water-based adhesive curing process and associated apparatus Public/Granted day:2009-05-07
Information query
IPC分类:
