Invention Grant
- Patent Title: Housing shell for an electronic device
- Patent Title (中): 电子设备外壳
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Application No.: US10563901Application Date: 2004-07-09
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Publication No.: US07964256B2Publication Date: 2011-06-21
- Inventor: Gunter Hesse , Ralf Neuhaus , Karl-Michael Reinfrank , Robert Kroib , Gunter Schobel , Wolfgang Gutting , Klaus Uske , Mark Szendro
- Applicant: Gunter Hesse , Ralf Neuhaus , Karl-Michael Reinfrank , Robert Kroib , Gunter Schobel , Wolfgang Gutting , Klaus Uske , Mark Szendro
- Applicant Address: DE
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE
- Agency: Connolly Bove Lodge & Hutz
- Priority: DE10331169 20030709
- International Application: PCT/EP2004/007559 WO 20040709
- International Announcement: WO2005/005543 WO 20050120
- Main IPC: B65D1/00
- IPC: B65D1/00 ; H01L23/06
Abstract:
A casing for an electronic device is produced from a heat-resistant, flame-retardant thermoplastic by an injection-molding process. This thermoplastic is a polyimide-based plastic with halogen-free flame retardancy.
Public/Granted literature
- US20070043149A1 Housing shell for an electronic device Public/Granted day:2007-02-22
Information query
