Invention Grant
US07964438B2 Method for forming a film with a graded bandgap by deposition of an amorphous material from a plasma
有权
通过从等离子体沉积非晶材料形成具有渐变带隙的膜的方法
- Patent Title: Method for forming a film with a graded bandgap by deposition of an amorphous material from a plasma
- Patent Title (中): 通过从等离子体沉积非晶材料形成具有渐变带隙的膜的方法
-
Application No.: US12447842Application Date: 2007-10-26
-
Publication No.: US07964438B2Publication Date: 2011-06-21
- Inventor: Pere Roca I Cabarrocas , Pavel Bulkin , Dmitri Daineka , Patrick Leempoel , Pierre Descamps , Thibault Kervyn De Meerendre
- Applicant: Pere Roca I Cabarrocas , Pavel Bulkin , Dmitri Daineka , Patrick Leempoel , Pierre Descamps , Thibault Kervyn De Meerendre
- Applicant Address: US MI Midland FR Palaiseau
- Assignee: Dow Corning Corporation,Ecole Polytechnique
- Current Assignee: Dow Corning Corporation,Ecole Polytechnique
- Current Assignee Address: US MI Midland FR Palaiseau
- Agency: Leason Ellis LLP
- Priority: EP06301117 20061102
- International Application: PCT/EP2007/009305 WO 20071026
- International Announcement: WO2008/052705 WO 20080508
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method is described of forming a film of an amorphous material on a substrate by deposition from a plasma. The substrate is placed in an enclosure, a film precursor gas is introduced into the enclosure, and unreacted and dissociated gas is extracted from the enclosure so as to provide a low pressure therein. Microwave energy is introduced into the gas within the enclosure to produce a plasma therein by distributed electron cyclotron resonance (DECR) and cause material to be deposited from the plasma on the substrate. The said flow rate of the film precursor gas is altered during the course of deposition of material, so as to cause the bandgap to vary over the thickness of the deposited material.
Public/Granted literature
- US20100062561A1 METHOD FOR FORMING A FILM WITH A GRADED BANDGAP BY DEPOSITION OF AN AMORPHOUS MATERIAL FROM A PLASMA Public/Granted day:2010-03-11
Information query
IPC分类: