Invention Grant
US07964456B2 Method of fabricating polysilicon thin film and thin film transistor using polysilicon fabricated by the same method 有权
使用同样方法制造的多晶硅薄膜晶体管和多晶硅晶体管的制造方法

  • Patent Title: Method of fabricating polysilicon thin film and thin film transistor using polysilicon fabricated by the same method
  • Patent Title (中): 使用同样方法制造的多晶硅薄膜晶体管和多晶硅晶体管的制造方法
  • Application No.: US11033493
    Application Date: 2005-01-12
  • Publication No.: US07964456B2
    Publication Date: 2011-06-21
  • Inventor: Ramesh Kakkad
  • Applicant: Ramesh Kakkad
  • Applicant Address: KR Giheung-Gu, Yongin, Gyunggi-Do
  • Assignee: Samsung Mobile Display Co., Ltd.
  • Current Assignee: Samsung Mobile Display Co., Ltd.
  • Current Assignee Address: KR Giheung-Gu, Yongin, Gyunggi-Do
  • Agent Robert E. Bushnell, Esq.
  • Priority: KR10-2004-0011146 20040219
  • Main IPC: H01L21/20
  • IPC: H01L21/20
Method of fabricating polysilicon thin film and thin film transistor using polysilicon fabricated by the same method
Abstract:
A method of fabricating a polysilicon thin film produces a polysilicon thin film which is used to make a thin film transistor. The method includes depositing a silicon film containing amorphous silicon on a substrate, and performing thermal treatment on the silicon film at a predetermined temperature in an H2O atmosphere. Accordingly, the crystallization temperature and thermal treatment time are decreased when the amorphous silicon is crystallized by a solid phase crystallization method, and this prevents the substrate from being bent due to application of a thermal treatment process for a long time and at a high temperature. As a result of the invention, a polysilicon thin film having superior crystallization properties is obtained. Use of the polysilicon thin film in a thin film transistor results in the reduction of defects in the thin film resistor.
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