Invention Grant
- Patent Title: Semiconductor package and method for manufacturing semiconductor package
- Patent Title (中): 半导体封装及半导体封装制造方法
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Application No.: US12441418Application Date: 2007-10-02
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Publication No.: US07964963B2Publication Date: 2011-06-21
- Inventor: Yuki Momokawa
- Applicant: Yuki Momokawa
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2006-273996 20061005
- International Application: PCT/JP2007/069251 WO 20071002
- International Announcement: WO2008/044537 WO 20080417
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/4763
Abstract:
A semiconductor package of this invention includes external electrode pad 5 which is formed by a conductive member that is made either of conductive resin or conductive ink, which is connected to an internal circuit of a semiconductor device, and which is to be electrically connected to an external portion, plating layer 6 which is provided on an entire surface of external electrode pad 5, and insulating resin layer 7 which covers plating layer 6 on a peripheral edge of external electrode pad 5, and which exposes a portion of plating layer 6 on external electrode pad 5.
Public/Granted literature
- US20090315176A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE Public/Granted day:2009-12-24
Information query
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