Invention Grant
- Patent Title: Chip structure
- Patent Title (中): 芯片结构
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Application No.: US12202342Application Date: 2008-09-01
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Publication No.: US07964973B2Publication Date: 2011-06-21
- Inventor: Mou-Shiung Lin , Chiu-Ming Chou , Chien-Kang Chou , Hsin-Jung Lo
- Applicant: Mou-Shiung Lin , Chiu-Ming Chou , Chien-Kang Chou , Hsin-Jung Lo
- Applicant Address: TW Hsinchu
- Assignee: Megica Corporation
- Current Assignee: Megica Corporation
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Priority: TW93124492A 20040812; TW93138329A 20041210
- Main IPC: H01L21/40
- IPC: H01L21/40

Abstract:
A method for fabricating a metallization structure comprises depositing a first metal layer; depositing a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposes said first metal layer; depositing a second metal layer over said first metal layer exposed by said first opening; depositing a second pattern-defining layer over said second metal layer, a second opening in said second pattern-defining layer exposes said second metal layer; depositing a third metal layer over said second metal layer exposed by said second opening; removing said second pattern-defining layer; removing said first pattern-defining layer; and removing said first metal layer not under said second metal layer.
Public/Granted literature
- US20090108453A1 CHIP STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-04-30
Information query
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