Invention Grant
- Patent Title: Multi-layered device
- Patent Title (中): 多层设备
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Application No.: US12524451Application Date: 2008-01-28
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Publication No.: US07965166B2Publication Date: 2011-06-21
- Inventor: Masanao Okawa , Hirofumi Konishi
- Applicant: Masanao Okawa , Hirofumi Konishi
- Applicant Address: JP Osaka
- Assignee: Panasonic Electric Works Co., Ltd.
- Current Assignee: Panasonic Electric Works Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2007-016737 20070126
- International Application: PCT/JP2008/051160 WO 20080128
- International Announcement: WO2008/091006 WO 20080731
- Main IPC: H01F5/00
- IPC: H01F5/00

Abstract:
A multilayered device comprises an insulation sheet 1 having at least two foldable areas 11, 12 which are multilayered by being folded; and a first conductor 21A, 22A which is formed on a first face 11A, 12A and constitutes a first coil 51A, 52A having one turn or more, and a second conductor 21B, 22B which is formed on a second face 11B, 12B and constitutes a second coil 51B, 52B having one turn or more in the same winding direction as that of the first coil in each of the foldable areas, at least four conductors are disposed in parallel with each other by folding the insulation sheet so as to constitute an inductor, and thus, it enables to thin the thickness of the multilayer, to downsize and to lightweight even when it constitutes a coil device having a larger winding number.
Public/Granted literature
- US20100079232A1 MULTI-LAYERED DEVICE Public/Granted day:2010-04-01
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