Invention Grant
US07965506B1 Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder
有权
用于允许空气直接流到其下的集成电路封装的散热装置和方法
- Patent Title: Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder
- Patent Title (中): 用于允许空气直接流到其下的集成电路封装的散热装置和方法
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Application No.: US11843324Application Date: 2007-08-22
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Publication No.: US07965506B1Publication Date: 2011-06-21
- Inventor: Zhihai Zack Yu , Don Le
- Applicant: Zhihai Zack Yu , Don Le
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Zilka-Kotab, PC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34
Abstract:
A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.
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