Invention Grant
- Patent Title: Electromagnetic bandgap structure and printed circuit board
- Patent Title (中): 电磁带隙结构和印刷电路板
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Application No.: US12010558Application Date: 2008-01-25
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Publication No.: US07965521B2Publication Date: 2011-06-21
- Inventor: Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
- Applicant: Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechantics Co., Ltd.
- Current Assignee: Samsung Electro-Mechantics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0041989 20070430
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
Public/Granted literature
- US20080266026A1 Electromagnetic bandgap structure and printed circuit board Public/Granted day:2008-10-30
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