Invention Grant
- Patent Title: On die thermal sensor
- Patent Title (中): 模具热传感器
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Application No.: US11647351Application Date: 2006-12-29
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Publication No.: US07965571B2Publication Date: 2011-06-21
- Inventor: Chun-Seok Jeong , Kee-Teok Park
- Applicant: Chun-Seok Jeong , Kee-Teok Park
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2006-0095162 20060928
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G01K1/08

Abstract:
An on die thermal sensor (ODTS) for use in a semiconductor memory device includes: a temperature information code generation unit for sensing an internal temperature of the semiconductor memory device in response to first and second enable signals and for generating a temperature information code which includes the sensed temperature information; and a flag signal logic determination unit for generating a plurality of first flag signals having temperature information and determining whether the plurality of first flag signals have a predetermined logic level or a variable logic level in response to the first and second enable signals.
Public/Granted literature
- US20080082291A1 On die thermal sensor Public/Granted day:2008-04-03
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