Invention Grant
- Patent Title: Characterizing curvatures and stresses in thin-film structures on substrates having spatially non-uniform variations
- Patent Title (中): 表征在具有空间不均匀变化的基底上的薄膜结构中的曲率和应力
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Application No.: US11567662Application Date: 2006-12-06
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Publication No.: US07966135B2Publication Date: 2011-06-21
- Inventor: Ares J. Rosakis , Yonggang Huang
- Applicant: Ares J. Rosakis , Yonggang Huang
- Applicant Address: US CA Pasadena
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadena
- Agency: Perkins Coie LLP
- Main IPC: G01L1/24
- IPC: G01L1/24

Abstract:
Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location.
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