Invention Grant
US07966135B2 Characterizing curvatures and stresses in thin-film structures on substrates having spatially non-uniform variations 有权
表征在具有空间不均匀变化的基底上的薄膜结构中的曲率和应力

Characterizing curvatures and stresses in thin-film structures on substrates having spatially non-uniform variations
Abstract:
Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location.
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