Invention Grant
- Patent Title: Circuit-connecting material and circuit terminal connected structure and connecting method
- Patent Title (中): 电路连接材料和电路端子连接结构和连接方法
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Application No.: US11841582Application Date: 2007-08-20
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Publication No.: US07968196B2Publication Date: 2011-06-28
- Inventor: Itsuo Watanabe , Tohru Fujinawa , Motohiro Arifuku , Houko Kanazawa , Atsushi Kuwano
- Applicant: Itsuo Watanabe , Tohru Fujinawa , Motohiro Arifuku , Houko Kanazawa , Atsushi Kuwano
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JP9-079422 19970331; JP9-079424 19970331; JP9-252933 19970918
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B32B27/20 ; B32B27/26 ; B32B27/30 ; C09J133/00 ; C09J163/00

Abstract:
A circuit-connecting material interposed between mutually-facing circuit electrodes, and electrically connecting the electrodes, either by direct contact, or via conductive particles present in the material. The circuit-connecting material features: (1) a curing agent capable of generating free radicals upon heating; (2) a radical-polymerizable substance, and two or more microscopically separated phases. The two or more microscopically separated phases include an elastomer phase of carboxyl-group-containing elastomer and a phenoxy resin phase of a phenoxy resin having a weight average molecular weight of 10,000 or more.
Public/Granted literature
- US20080057742A1 CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD Public/Granted day:2008-03-06
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