Invention Grant
US07968801B2 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure
失效
焊接安装结构，这种焊接安装结构的制造方法以及这种焊料安装结构的使用
- Patent Title: Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure
- Patent Title (中): 焊接安装结构，这种焊接安装结构的制造方法以及这种焊料安装结构的使用
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Application No.: US12011565Application Date: 2008-01-25
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Publication No.: US07968801B2Publication Date: 2011-06-28
- Inventor: Kazuo Kinoshita
- Applicant: Kazuo Kinoshita
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Edwards Angell Palmer & Dodge LLP
- Agent David G. Conlin
- Priority: JP2005-219547 20050728
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
The camera module structure (10) of the present invention is arranged such that a board electrode (2) of a printed board (1) and a mounting electrode (4) of a camera module (3) mounted on the printed board (1) are joined with each other through a solder joint section (5), and the board electrode (2) and the mounting electrode (4) are aligned by self-alignment. The solder joint section (5) includes a solder section (16) for solder-joining, and a supporting section (17) for supporting the camera module (3). The present invention realizes a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment.
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