Invention Grant
- Patent Title: Multi-voltage housing
- Patent Title (中): 多电压外壳
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Application No.: US12220409Application Date: 2008-07-23
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Publication No.: US07968806B2Publication Date: 2011-06-28
- Inventor: Mark Shelton , Marc Bowman , Jim Bernklau , Jeff Stone , Roger McCoy
- Applicant: Mark Shelton , Marc Bowman , Jim Bernklau , Jeff Stone , Roger McCoy
- Applicant Address: US OR Portland
- Assignee: Veris Industries, LLC
- Current Assignee: Veris Industries, LLC
- Current Assignee Address: US OR Portland
- Agency: Chernoff, Vilhauer, McClung & Stenzel
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A housing for one or more electrical components that are connected to sources of a plurality of voltages comprises a box, a first cover to cover a first portion of the opening in the box and a second cover to cover a second portion of the opening. The first cover includes a separator that projects into the box when the first cover is installed to divide the interior of the box and so that components connectable to a higher voltage can be separated from components connectable to a lower voltage.
Public/Granted literature
- US20090065247A1 Multi - voltage housing Public/Granted day:2009-03-12
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