Invention Grant
- Patent Title: Thin-body bipolar device
- Patent Title (中): 薄体双极器件
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Application No.: US12500915Application Date: 2009-07-10
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Publication No.: US07968971B2Publication Date: 2011-06-28
- Inventor: Shine Chung , Fu-Lung Hsueh
- Applicant: Shine Chung , Fu-Lung Hsueh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: K&L Gates LLP
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A thin-body bipolar device includes: a semiconductor substrate, a semiconductor fin constructed over the semiconductor substrate, a first region of the semiconductor fin having a first conductivity type, the first region serving as a base of the thin-body bipolar device, and a second and third region of the semiconductor fin having a second conductivity type opposite to the first conductivity type, the second and third region being both juxtaposed with and separated by the first region, the second and third region serving as an emitter and collector of the thin-body bipolar device, respectively.
Public/Granted literature
- US20100320572A1 Thin-Body Bipolar Device Public/Granted day:2010-12-23
Information query
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