Invention Grant
- Patent Title: Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
- Patent Title (中): 在集成电路中用高磁导率开槽板芯改善电感的方法
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Application No.: US12202665Application Date: 2008-09-02
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Publication No.: US07969274B2Publication Date: 2011-06-28
- Inventor: Kenneth D. Brennan , Satyavolu S. Papa Rao , Byron Williams
- Applicant: Kenneth D. Brennan , Satyavolu S. Papa Rao , Byron Williams
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01F5/00
- IPC: H01F5/00

Abstract:
An inductor structure (102) formed in an integrated circuit (100) is disclosed, and includes a first isolation layer (106) and a first core plate (104) disposed over or within the first isolation layer (106, 114). The first core plate (104) includes a plurality of electrically coupled conductive traces composed of a conductive ferromagnetic material layer. A second isolation layer (108) overlies the first isolation layer and an inductor coil (102) composed of a conductive material layer (118) is formed within the second isolation layer (108). Another core plate may be formed over the coil. The one or more core plates increase an inductance (L) of the inductor coil (102).
Public/Granted literature
- US20090002115A1 METHOD TO IMPROVE INDUCTANCE WITH A HIGH-PERMEABILITY SLOTTED PLATE CORE IN AN INTEGRATED CIRCUIT Public/Granted day:2009-01-01
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