Invention Grant
- Patent Title: Heat transfer system, method, and computer program product for use with multiple circuit board environments
- Patent Title (中): 传热系统，方法和计算机程序产品，用于多个电路板环境
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Application No.: US12336851Application Date: 2008-12-17
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Publication No.: US07969733B1Publication Date: 2011-06-28
- Inventor: Samuel Abbay , Jeong Hun Kim , Don Le
- Applicant: Samuel Abbay , Jeong Hun Kim , Don Le
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Zilka-Kotab, PC
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.
Information query
