Invention Grant
- Patent Title: Heat sink assembly with temperature display
- Patent Title (中): 带温度显示的散热器组件
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Application No.: US12501484Application Date: 2009-07-12
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Publication No.: US07969743B2Publication Date: 2011-06-28
- Inventor: Xiao-Feng Ma , Lei Liu , Chia-Shin Chou
- Applicant: Xiao-Feng Ma , Lei Liu , Chia-Shin Chou
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent Zhigang Ma
- Priority: CN200910303692 20090625
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G01R31/26 ; G01K7/02 ; G01K1/14

Abstract:
A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol.
Public/Granted literature
- US20100328897A1 HEAT SINK ASSEMBLY WITH TEMPERATURE DISPLAY Public/Granted day:2010-12-30
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