Invention Grant
- Patent Title: Apparatus and method for connection test on printed circuit board
- Patent Title (中): 印刷电路板连接测试装置及方法
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Application No.: US12411060Application Date: 2009-03-25
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Publication No.: US07970569B2Publication Date: 2011-06-28
- Inventor: Kazuharu Nakano , Mikiko Kikuchi
- Applicant: Kazuharu Nakano , Mikiko Kikuchi
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
A connection test apparatus includes a controlling section, controlling each connection test device to switch the operation mode between the first and the second modes such that a first connection test device among the connection test devices is in the first mode and the remaining connection devices are in the second mode, and controlling a signal generating circuit to output the connection test signal; and a judging section judging, on the basis of the response signal that the first connection test device outputs in response to the connection test signal, a state of connection of a first connector connected to the first connection test device and a first net including the first connector among the nets.
Public/Granted literature
- US20090182523A1 APPARATUS AND METHOD FOR CONNECTION TEST ON PRINTED CIRCUIT BOARD Public/Granted day:2009-07-16
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