Invention Grant
- Patent Title: Fabricating method for earphone
- Patent Title (中): 耳机制作方法
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Application No.: US12169022Application Date: 2008-07-08
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Publication No.: US07971338B2Publication Date: 2011-07-05
- Inventor: Chien-cheng Yang , Hui-yin Liang
- Applicant: Chien-cheng Yang , Hui-yin Liang
- Applicant Address: TW Taichung
- Assignee: Merry Electronics Co., Ltd.
- Current Assignee: Merry Electronics Co., Ltd.
- Current Assignee Address: TW Taichung
- Agent Chun-Ming Shih
- Main IPC: H04R31/00
- IPC: H04R31/00

Abstract:
A fabricating method for an earphone includes the steps of: providing a front case and a speaker, the front case having a plurality of securing holes and a accommodating space, the speaker being disposed in the accommodating space; electrically connecting an earphone wire to the speaker; providing a rear case and securing the rear case onto the front case by making use of a plurality of fasteners penetrating through the rear case and fitted into the securing holes of the front case, and thereby the speaker is fixed in the accommodating space by the stop effect of the rear case; and buckling a protecting cover on the rear case to cover the fasteners. The fabricating method can make the produced earphone to be more reliable and thus can effectively avoid from being disassembled caused by an external force or unexpected falling, and therefore the internal components thereof can be effectively protected from damage.
Public/Granted literature
- US20100008531A1 Fabricating Method for Earphone Public/Granted day:2010-01-14
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