Invention Grant
- Patent Title: Method of manufacturing a conductor assembly
- Patent Title (中): 制造导体组件的方法
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Application No.: US12133721Application Date: 2008-06-05
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Publication No.: US07971342B2Publication Date: 2011-07-05
- Inventor: Rainer Meinke
- Applicant: Rainer Meinke
- Applicant Address: US FL Palm Bay
- Assignee: Advanced Magnet Lab, Inc.
- Current Assignee: Advanced Magnet Lab, Inc.
- Current Assignee Address: US FL Palm Bay
- Agency: Beusse, Wolter, Sanks, Mora & Maire, P.A.
- Agent Ferdinand M. Romano
- Main IPC: H01F7/06
- IPC: H01F7/06

Abstract:
A conductor assembly and method of manufacture. The assembly includes a magnetic coil positioned about a curvilinear axis with one or more coil rows comprising conductive material having an arcuate shape. A generated field is characterized by a dipole component having a first magnitude, a quadrupole component having a second magnitude, a sextupole component having a third magnitude and a decupole component having a fourth magnitude. The third and fourth magnitudes are each 10−3 the first magnitude or less.
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