A component-embedded substrate includes a component embedded in an uncured resin layer of a second layer. After curing the resin layer, a hole passing through the second layer in the vertical direction is formed. The hole is filled with an electroconductive paste to form a second interlayer connection conductor. A first in-plane conductor including a plurality of lands, a first layer, and the second layer are respectively stacked in that order and pressed to join together, and the first layer is heated to form an integrated structure. A method for manufacturing the component-embedded substrate can form an interlayer connection conductor having a small diameter and high straightness and thus can achieve a miniaturized component-embedded substrate including interlayer connection conductors at a narrow pitch.