Invention Grant
- Patent Title: Small-sized electronic casing and method of manufacturing small-sized electronic casing
- Patent Title (中): 小型电子外壳及小型电子外壳的制造方法
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Application No.: US11628296Application Date: 2005-12-22
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Publication No.: US07971464B2Publication Date: 2011-07-05
- Inventor: Motonobu Hachino , Kenichi Ogura
- Applicant: Motonobu Hachino , Kenichi Ogura
- Applicant Address: JP Tokyo
- Assignee: Furukawa-Sky Aluminum Corp.
- Current Assignee: Furukawa-Sky Aluminum Corp.
- Current Assignee Address: JP Tokyo
- Agency: Bacon & Thomas, PLLC
- Priority: JP2004-375052 20041224
- International Application: PCT/JP2005/023642 WO 20051222
- International Announcement: WO2006/068240 WO 20060629
- Main IPC: B21C23/00
- IPC: B21C23/00 ; B21C23/04

Abstract:
One mode of the present invention relates to a small-sized electronic casing comprising an aluminum alloy extruded shape having a hollow sectional part at least contained in a main part, wherein the extruded shape has at least either component-mounting holes or notches. Another mode of the present invention relates to a small-sized electronic casing manufacturing method that comprises a press punching process of forming at least either component-mounting holes or notches in an aluminum alloy extruded shape of a prescribed length having a hollow sectional part. The present invention may provide an aluminum alloy casing that is excellent in formability and productivity, has a smaller thickness and provides higher dimensional precision.
Public/Granted literature
- US20070236870A1 Small-Sized Electronic Casing and Method of Manufacturing Small-Sized Electronic Casing Public/Granted day:2007-10-11
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