Invention Grant
- Patent Title: Stamping device and stamping method
- Patent Title (中): 冲压装置和冲压方法
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Application No.: US12311623Application Date: 2008-05-30
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Publication No.: US07971467B2Publication Date: 2011-07-05
- Inventor: Kouji Yamada
- Applicant: Kouji Yamada
- Applicant Address: JP Anjo-Shi
- Assignee: Toyotomi Kiko Co., Ltd.
- Current Assignee: Toyotomi Kiko Co., Ltd.
- Current Assignee Address: JP Anjo-Shi
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-088282 20080328
- International Application: PCT/JP2008/060049 WO 20080530
- International Announcement: WO2009/118918 WO 20091001
- Main IPC: B21D31/00
- IPC: B21D31/00 ; B21D22/00

Abstract:
The present application provides a technique for simultaneously bending and drawing.In a stamping device, the timing at which an upper pad moves downward and grips a work piece between the upper pad and a first supporting surface is adjusted so as not to be later than the timing at which an upper bending steel makes contact with the work piece. The height of a lower end of the upper bending steel after the timing at which the upper bending steel has made contact with the work piece, and the height of a lower surface of a drawing pad after the timing at which the work piece has been gripped between the drawing pad and a third supporting surface are adjusted such that the lower end of the upper bending steel and the lower surface of the drawing pad move downward while maintaining the same height at a boundary between the upper bending steel and the drawing pad.
Public/Granted literature
- US20100186476A1 Stamping device and stamping method Public/Granted day:2010-07-29
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