Invention Grant
- Patent Title: Paper punch die and paper punch with such a die
- Patent Title (中): 纸模冲模和纸模冲模
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Application No.: US11669981Application Date: 2007-02-01
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Publication No.: US07971513B2Publication Date: 2011-07-05
- Inventor: Kwok Ki Stephen Chan
- Applicant: Kwok Ki Stephen Chan
- Applicant Address: CN Hong Kong
- Assignee: Lee Tack Plastic & Metal Manufactory, Ltd.
- Current Assignee: Lee Tack Plastic & Metal Manufactory, Ltd.
- Current Assignee Address: CN Hong Kong
- Agency: Coleman Sudol Sapone P.C.
- Agent William J. Sapone
- Main IPC: B26F1/14
- IPC: B26F1/14
Abstract:
A paper punch die (125) is disclosed as including a top part (110, 202, 302) and a platform (100, 206, 306) engaged with each other, the platform (100, 206, 306) having an upper major surface (106) and a lower major surface (126, 207, 307), the upper major surface of the platform (100, 206, 306) being in abutment with a lower major surface (118) of the top part (110, 202, 302), and an endless wall (130) with an undulating cutting edge (132) extending away from the lower major surface (126, 207, 307) of the platform (100, 206, 306). There is also disclosed a paper punch (140) including such a paper punch die (125).
Public/Granted literature
- US20080184862A1 Paper Punch Die and Paper Punch With Such a Die Public/Granted day:2008-08-07
Information query
IPC分类:
