Invention Grant
- Patent Title: Sawing strip and method for simultaneously cutting off a multiplicity of slices from a cylindrical workpiece using a sawing strip
- Patent Title (中): 锯条和使用锯切条从圆筒形工件同时切割多个切片的方法
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Application No.: US11774165Application Date: 2007-07-06
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Publication No.: US07971584B2Publication Date: 2011-07-05
- Inventor: Peter Wiesner
- Applicant: Peter Wiesner
- Applicant Address: DE Munich
- Assignee: Siltronic AG
- Current Assignee: Siltronic AG
- Current Assignee Address: DE Munich
- Agency: Brooks Kushman P.C.
- Priority: DE102006032432 20060713
- Main IPC: B28D1/12
- IPC: B28D1/12

Abstract:
A sawing strip for fixing a substantially cylindrical workpiece when cutting off slices from this workpiece with a wire saw has a first face, which is concavely curved perpendicular to its longitudinal direction for connecting to the workpiece, a second face opposite the first face for connecting to a mounting plate, and two side faces which connect the first face and the second face, two edges of the sawing strip at which the side faces meet the first face at a distance a from each other, an imaginary line on the first face marking its minimum distance d from the second face, the side faces being at a distance b, measured at the height of the line and perpendicular to the distance d, wherein the distance b is less than the distance a. The sawing strip is useful for decreasing waviness of wafers cut from a cylindrical workpiece using the sawing strip.
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