Invention Grant
- Patent Title: Loop type micro heat transport device
- Patent Title (中): 环型微型热输送装置
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Application No.: US11577233Application Date: 2005-12-09
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Publication No.: US07971633B2Publication Date: 2011-07-05
- Inventor: Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
- Applicant: Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2004-0104284 20041210; KR10-2005-0043467 20050524
- International Application: PCT/KR2005/004209 WO 20051209
- International Announcement: WO2006/062371 WO 20060615
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.
Public/Granted literature
- US20070256814A1 Loop Type Micro Heat Transport Device Public/Granted day:2007-11-08
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