Invention Grant
- Patent Title: Electrical connection structure, liquid ejection head, method of manufacturing same, and image forming apparatus
- Patent Title (中): 电气连接结构，液体喷射头，其制造方法和图像形成装置
-
Application No.: US11520582Application Date: 2006-09-14
-
Publication No.: US07971973B2Publication Date: 2011-07-05
- Inventor: Yasuhiko Maeda
- Applicant: Yasuhiko Maeda
- Applicant Address: JP Tokyo
- Assignee: Fujifilm Corporation
- Current Assignee: Fujifilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-270727 20050916
- Main IPC: B41J2/05
- IPC: B41J2/05
Abstract:
The electrical connection structure includes: a first substrate which has a first electrode part; a second substrate which has a second electrode part opposing the first electrode part, and a wiring pattern connected to the second electrode part; an insulating cavity substrate which is disposed between the first substrate and the second substrate and has a through hole in a position corresponding to the first electrode part, the through hole being deeper that a sum of a height of the first electrode part and a height of the second electrode part and having an opening surface area not smaller that an area of the first electrode part; and conductive material which is filled in the through hole.
Public/Granted literature
Information query
IPC分类:
