Invention Grant
US07971987B2 Heated drum assembly having integrated thermal sensing for use in a printer
有权
具有集成热敏感的加热鼓组件用于打印机
- Patent Title: Heated drum assembly having integrated thermal sensing for use in a printer
- Patent Title (中): 具有集成热敏感的加热鼓组件用于打印机
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Application No.: US12039846Application Date: 2008-02-29
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Publication No.: US07971987B2Publication Date: 2011-07-05
- Inventor: Amin M. Godil , Larry E. Hindman , Isaac S. Frazier , Walter Sean Harris , William Bruce Weaver
- Applicant: Amin M. Godil , Larry E. Hindman , Isaac S. Frazier , Walter Sean Harris , William Bruce Weaver
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Maginot, Moore & Beck LLP
- Main IPC: B41J2/01
- IPC: B41J2/01

Abstract:
A heated drum assembly enables improved thermal control of a hollow drum in the heated drum assembly by integrating thermal sensing devices in the assembly. The heated drum assembly includes a hollow drum having a circumferential wall that defines an outer boundary for an internal cavity, the hollow drum having a first end and a second end and a longitudinal axis about which the hollow drum rotates, a stationary heater that is located within the internal cavity of the hollow drum to heat the circumferential wall as it passes by the heater, the heater having a reflector with at least one wall and at least one heating element between the reflector and the circumferential wall of the hollow drum, the reflector and a portion of the circumferential wall subtended by the reflector forming a heating zone, an insulating shield mounted to the wall of the reflector, a thermal cutout mounted on the insulating shield, a support arm having a first end and a second end, the first end of the support arm being mounted to the insulating shield, and a thermal sensor mounted to the second end of the support arm.
Public/Granted literature
- US20090219328A1 Heated Drum Assembly Having Integrated Thermal Sensing For Use In A Printer Public/Granted day:2009-09-03
Information query
IPC分类: