Invention Grant
- Patent Title: Header assembly for communications module
- Patent Title (中): 通讯模块头组件
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Application No.: US12506093Application Date: 2009-07-20
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Publication No.: US07972068B2Publication Date: 2011-07-05
- Inventor: Martin A. Kalberer , Hongyu Deng , Maziar Amirkiai
- Applicant: Martin A. Kalberer , Hongyu Deng , Maziar Amirkiai
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Gilmore & Israelsen
- Main IPC: G02B6/36
- IPC: G02B6/36

Abstract:
In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend.
Public/Granted literature
- US20110013912A1 HEADER ASSEMBLY FOR COMMUNICATIONS MODULE Public/Granted day:2011-01-20
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