Invention Grant
- Patent Title: Printed circuit assembly
- Patent Title (中): 印刷电路组件
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Application No.: US12364333Application Date: 2009-02-02
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Publication No.: US07972143B2Publication Date: 2011-07-05
- Inventor: Dalibor Smejtek
- Applicant: Dalibor Smejtek
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A printed circuit assembly includes a base printed circuit having a printed circuit receiving area and a plurality of electrical contacts provided on the printed circuit receiving area. The printed circuit assembly also includes a secondary printed circuit having a secondary substrate including a mating edge and a plurality of secondary contacts provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.
Public/Granted literature
- US20100197150A1 PRINTED CIRCUIT ASSEMBLY Public/Granted day:2010-08-05
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