Invention Grant
- Patent Title: Electrical contact having additional mounting feet arranged to ensure reliable electrical connections with conductive pad around via of circuit board
- Patent Title (中): 电触点具有额外的安装脚布置,以确保与电路板周围的导电垫片的可靠电连接
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Application No.: US12549396Application Date: 2009-08-28
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Publication No.: US07972144B2Publication Date: 2011-07-05
- Inventor: Chun-Yi Chang , Jia-Hau Liu
- Applicant: Chun-Yi Chang , Jia-Hau Liu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: TW97215667U 20080901
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A contact (1) for an electrical connector mountable on a substrate (3) having at least a via (311) therethrough comprises a medial portion (10), a contact engaging portion (121) extending from the medial portion (10), a solder terminal portion extending from the medial portion (10) in a direction away from said contact engaging portion (121) and includes at least a first spring arm (11) having a standing point (111), and at least an auxiliary foot (112) extending sideway from the first spring arm (11) having a distance with respect to the standing point (111), the contact engaging portion (121) is adapted to engage with a mating contact.
Public/Granted literature
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