Invention Grant
- Patent Title: Board with connection terminals
- Patent Title (中): 连接端子板
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Application No.: US12856940Application Date: 2010-08-16
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Publication No.: US07972149B2Publication Date: 2011-07-05
- Inventor: Yoshihiro Ihara
- Applicant: Yoshihiro Ihara
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2009-196287 20090827
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
Connection terminals each include: a bonding portion bonded to a pad of a substrate; a contacting portion disposed to face the bonding portion; a spring portion present between the bonding portion and the contacting portion; and an engaging portion engaged with a portion of a slit provided in a plate-like member. These constituent portions of the connection terminal are formed integrally with each other. The plate-like member has recessed portions formed at predetermined positions, and the connection terminals are electrically connected to the pads of the substrate with the bonding portions of the connection terminals being locked to the recessed portions.
Public/Granted literature
- US20110053392A1 BOARD WITH CONNECTION TERMINALS Public/Granted day:2011-03-03
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