Invention Grant
- Patent Title: Elastic sheet structure
- Patent Title (中): 弹性片结构
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Application No.: US12749647Application Date: 2010-03-30
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Publication No.: US07972186B2Publication Date: 2011-07-05
- Inventor: Mei-Tsu Tsao
- Applicant: Mei-Tsu Tsao
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Steven M. Reiss
- Priority: CN200910304227 20090710
- Main IPC: H01R4/02
- IPC: H01R4/02
Abstract:
An elastic sheet structure includes a plate portion, two wedged portion formed at opposite sides of the plate portion, and a latching portion formed another side of the plate portion. The wedged portion and the latching portion can be formed by bending two extending portions of the plate portion downwardly, the wedged portion is used to resist with a circuit board, the latching portion is for insertion into a hole of the circuit board to latch with the circuit board.
Public/Granted literature
- US20110009013A1 ELASTIC SHEET STRUCTURE Public/Granted day:2011-01-13
Information query
