Invention Grant
- Patent Title: Tire grinding method and grinding device
- Patent Title (中): 轮胎研磨方法和研磨装置
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Application No.: US12090788Application Date: 2006-10-18
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Publication No.: US07972195B2Publication Date: 2011-07-05
- Inventor: Yuichiro Ogawa
- Applicant: Yuichiro Ogawa
- Applicant Address: JP Tokyo
- Assignee: Bridgestone Corporation
- Current Assignee: Bridgestone Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-303118 20051018
- International Application: PCT/JP2006/320721 WO 20061018
- International Announcement: WO2007/046404 WO 20070426
- Main IPC: B24B49/00
- IPC: B24B49/00

Abstract:
In a grinding device, first, an eddy-current-sensor detects a distance from the eddy-current-sensor to an outer peripheral surface of a belt layer while a tire to be retreaded held by a pair of half rims is caused to rotate. Thus, an eccentricity amount and an eccentricity direction of the tire to be retreaded with respect to a device axial center, corresponding to the phase of the tire to be retreaded, can be respectively determined, so position control signals corresponding to the phase, eccentricity amount and eccentricity direction of the tire to be retreaded can be generated. Next, on the basis of the position control signal, a carriage causes a rasp to be moved in a radial direction with respect to the tire to be retreaded along the radial direction whose center is a device axial center, and the rasp grinds a tread surface of the rotating tire to be retreaded.
Public/Granted literature
- US20090291618A1 TIRE GRINDING METHOD AND GRINDING DEVICE Public/Granted day:2009-11-26
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