Invention Grant
- Patent Title: Ultrasonic cut and bonded elastic material
- Patent Title (中): 超声波切割和粘合弹性材料
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Application No.: US11860672Application Date: 2007-09-25
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Publication No.: US07972455B2Publication Date: 2011-07-05
- Inventor: Wai Ching Andy Lau
- Applicant: Wai Ching Andy Lau
- Applicant Address: HK Kowloon
- Assignee: Clover Group International Limited
- Current Assignee: Clover Group International Limited
- Current Assignee Address: HK Kowloon
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: A41C5/00
- IPC: A41C5/00 ; B29C65/08
Abstract:
A method of forming a hem of an elastic material includes laying a first stretch fabric sheet upon a second stretch fabric sheet, cutting an excess edge strip from the first stretch fabric sheet and the second stretch fabric sheet along a fuse line and simultaneously fusing the sheets together along the fuse line, positioning an elastic strip between the first and second sheets along the fuse line, and fusing the elastic strip to one of the sheets to form a hem.
Public/Granted literature
- US20080081166A1 ULTRASONIC CUT AND BONDED ELASTIC MATERIAL Public/Granted day:2008-04-03
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