Invention Grant
- Patent Title: Plasma processing apparatus
- Patent Title (中): 等离子体处理装置
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Application No.: US11738505Application Date: 2007-04-22
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Publication No.: US07972469B2Publication Date: 2011-07-05
- Inventor: Hiroji Hanawa , Andrew Nguyen , Keiji Horioka , Kallol Bera , Kenneth S. Collins , Lawrence Wong , Martin Jeff Salinas , Roger A. Lindley , Hong S. Yang
- Applicant: Hiroji Hanawa , Andrew Nguyen , Keiji Horioka , Kallol Bera , Kenneth S. Collins , Lawrence Wong , Martin Jeff Salinas , Roger A. Lindley , Hong S. Yang
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser IP Law Group
- Agent Alan Taboada
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a plasma control magnet assembly includes a plurality of magnets arranged in a predetermined pattern that generate a magnetic field having a strength greater than 10 Gauss in a region proximate the assembly and less than 10 Gauss in a region remote from the assembly.
Public/Granted literature
- US20080257261A1 PLASMA PROCESSING APPARATUS Public/Granted day:2008-10-23
Information query
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