Invention Grant
- Patent Title: Process for producing microsphere with use of metal substrate having through-hole
- Patent Title (中): 使用具有通孔的金属基材制造微球的方法
-
Application No.: US11577474Application Date: 2005-10-11
-
Publication No.: US07972543B2Publication Date: 2011-07-05
- Inventor: Mitsutoshi Nakajima , Taiji Nishi , Seiichi Kanai , Takenori Kitani , Motohiro Fukuda
- Applicant: Mitsutoshi Nakajima , Taiji Nishi , Seiichi Kanai , Takenori Kitani , Motohiro Fukuda
- Applicant Address: JP Tsukuba-shi JP Kurashiki-shi JP Tsukuba-shi
- Assignee: National Agriculture and Food Research Organization,Kuraray Co., Ltd.,Mitsutoshi Nakajima
- Current Assignee: National Agriculture and Food Research Organization,Kuraray Co., Ltd.,Mitsutoshi Nakajima
- Current Assignee Address: JP Tsukuba-shi JP Kurashiki-shi JP Tsukuba-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-302378 20041018
- International Application: PCT/JP2005/018688 WO 20051011
- International Announcement: WO2006/043443 WO 20060427
- Main IPC: B29B9/00
- IPC: B29B9/00

Abstract:
An object of the present invention is to provide a process for producing microspheres that are solid microparticles or liquid microparticles for use as an emulsion employed in the food industry, production of medicine and cosmetic etc. or an emulsion for DDS (drug delivery system). The object is attained by a process for producing a microsphere including: separating a disperse phase from a continuous phase by a substrate 1 having a through-hole 7; and extruding the disperse phase into the continuous phase through the through-hole 7, in which the substrate having the through-hole 7 with a width of 0.5 to 500 μm, a depth of 10 μm to 6000 μm and a ratio of the width to the depth of the through-hole 7 of 1 to 1/30 is a metal substrate.
Public/Granted literature
- US20080061459A1 Process for Producing Microsphere with Use of Metal Substrate having Through-Hole Public/Granted day:2008-03-13
Information query