Invention Grant
- Patent Title: Resin multilayer injection molding method
- Patent Title (中): 树脂多层注塑法
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Application No.: US12311826Application Date: 2007-10-12
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Publication No.: US07972544B2Publication Date: 2011-07-05
- Inventor: Akio Okamoto , Kazuaki Miyamoto
- Applicant: Akio Okamoto , Kazuaki Miyamoto
- Applicant Address: JP Ube-shi
- Assignee: Ube Machinery Corporation, Ltd.
- Current Assignee: Ube Machinery Corporation, Ltd.
- Current Assignee Address: JP Ube-shi
- Agency: Edwards Angell Palmer & Dodge LLP
- Priority: JP2006-284125 20061018
- International Application: PCT/JP2007/069990 WO 20071012
- International Announcement: WO2008/047724 WO 20080424
- Main IPC: B29C45/16
- IPC: B29C45/16 ; B29C45/66 ; B29C45/70

Abstract:
While a second layer resin is being charged, a movable platen is moved backward to reach a given movable platen position (S1) to enlarge the capacity of a second cavity. After the completion of charging of the resin, a toggle mechanism is promptly driven to reduce the second cavity capacity to reach a given movable platen position (S2), and after the lapse of a given time, the toggle mechanism is driven again to enlarge the second cavity capacity to reach a given movable platen position (S3). Thus, a high quality multilayer injection molded article which has small variations in the wall thickness, dimension, and mass and which is free from deformation or warpage can be stable obtained.
Public/Granted literature
- US20100308500A1 Resin multiplayer injection molding method Public/Granted day:2010-12-09
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