Invention Grant
- Patent Title: Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus
- Patent Title (中): 形成多层结构的方法,布线基板的制造方法以及电子设备的制造方法
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Application No.: US11196677Application Date: 2005-08-04
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Publication No.: US07972651B2Publication Date: 2011-07-05
- Inventor: Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
- Applicant: Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-274621 20040922
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photosensitive resin to a material-body surface; (B) obtaining a first insulating layer by curing in the first insulating-material layer; (C) forming a pattern of an electric conductive material layer on the first insulating layer by discharging a droplet of an electric conductive material to the first insulating layer; and (D) forming a wiring pattern on the first insulating layer by activating the pattern of the electric conductive material layer.
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