Invention Grant
- Patent Title: Electroless plating system
- Patent Title (中): 无电镀系统
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Application No.: US11549644Application Date: 2006-10-14
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Publication No.: US07972652B2Publication Date: 2011-07-05
- Inventor: Igor Ivanov , Robert D. Tas , Shashank Ravindra Kulkarni , Ron Rulkens
- Applicant: Igor Ivanov , Robert D. Tas , Shashank Ravindra Kulkarni , Ron Rulkens
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla & Gencarella, LLP
- Main IPC: B05D5/12
- IPC: B05D5/12 ; B28B19/00 ; B29B15/10 ; C23C18/00 ; C23C20/00 ; C23C24/00 ; C23C26/00 ; C23C28/00 ; H01C17/06 ; H05K3/00
Abstract:
An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
Public/Granted literature
- US20090253262A1 ELECTROLESS PLATING SYSTEM Public/Granted day:2009-10-08
Information query
