Invention Grant
- Patent Title: Planarizing coating method
- Patent Title (中): 平面涂布方法
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Application No.: US11937266Application Date: 2007-11-08
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Publication No.: US07972654B2Publication Date: 2011-07-05
- Inventor: Akihiko Nakamura
- Applicant: Akihiko Nakamura
- Applicant Address: JP Kanagawa
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Carrier Blackman & Associates, P.C.
- Agent Joseph P. Carrier; William D. Blackman
- Priority: JP2006-302181 20061108
- Main IPC: B05D3/12
- IPC: B05D3/12 ; B05D1/38

Abstract:
A planarizing coating method for filling a step between patterns formed on a board surface, includes the steps of: preparing at least two types of coating liquids different in non-volatile matter densities, first coating one of the coating liquids higher in density on the board surface, rotating the board so as to leave the one coating liquid inside the step and such that, at the same time, substantially none of the one coating liquid is left on a pattern crest of the patterns, subsequently coating another of the coating liquids lower in non-volatile matter density on the board surface, and rotating the board so that the coating liquid lower in density is left on a coating film comprising the one coating liquid higher in density and such that, at the same time, substantially none of the other coating liquid lower in density left on the pattern crest.
Public/Granted literature
- US20080254215A1 PLANARIZING COATING METHOD Public/Granted day:2008-10-16
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