Invention Grant
US07972670B2 Structured paper release liner, adhesive-backed article assembly and method of making same
有权
结构纸剥离衬垫,粘合剂背衬制品组装及其制造方法
- Patent Title: Structured paper release liner, adhesive-backed article assembly and method of making same
- Patent Title (中): 结构纸剥离衬垫,粘合剂背衬制品组装及其制造方法
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Application No.: US10595835Application Date: 2004-11-19
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Publication No.: US07972670B2Publication Date: 2011-07-05
- Inventor: David S. Seitz , Kanta Kumar , Larry A. Meixner , Mieczyslaw H. Mazurek , Stefan O. Dietrich
- Applicant: David S. Seitz , Kanta Kumar , Larry A. Meixner , Mieczyslaw H. Mazurek , Stefan O. Dietrich
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- International Application: PCT/US2004/038976 WO 20041119
- International Announcement: WO2005/052082 WO 20050609
- Main IPC: B32B33/00
- IPC: B32B33/00 ; B32B5/02 ; B32B3/00

Abstract:
A structured paper release liner (10) for use with an article (44) backed with a pressure sensitive adhesive, an adhesive-backed article assembly (42) and methods of making each are disclosed. The liner (10) comprises a piece of paper (14) having a release side free of a structural support layer, a back side, and a structured release surface (48) having a pattern formed into the paper (14) on the release side. A release material is on the structured release surface of the paper. The pattern formed in the paper (14) is designed so as to form fluid egress channels in a bonding surface of the pressure sensitive adhesive (46). The fluid egress channels define a structured bonding surface (48) having exit pathways for fluid to bleed out from behind the article when the structured bonding surface (48) is adhered to or otherwise disposed on a substrate.
Public/Granted literature
- US20070166501A1 Structured paper release liner, adhesive-backed article assembly and method of making same Public/Granted day:2007-07-19
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